SLIDE SWITCH-Where to go next-generation transistor technology

Electronic technSLIDE SWITCHology development so far， mainly in what fight? Power consumption， cost， fast becoming a killerDC JACK outreach many companies， then in this era of fast food， the next-generation transistor technology in turn go?

A lot of money and effort is spent exploring FinFET process， how long it will last and how to replace them?

In the near future， from the advanced chip3.5mm PHONE JACK technology roadmap already seen quite clearly。 Based on today´s chips will FinFET technology or another planar FDSOI process technology， is expected to be reduced to 10nm node。 But when 7nm and below the current CMOS technology roadmap has been not very clear。

The semiconductor industry has explored a number ofSMD TACT SWITCH candidates for the next generation transistor technology。 For example， when 7nm， FinFET using high mobility and with a III-V group elements as a channel material to improve the mobility of charges。 Then， when the 5nm， there may be two techniques， one of which is a ring-gate FET， and theMICRO USB CONNECTOR other is a tunnel FET (TFET)， they have a slight advantage in the comparison。 The reason is because the ultimate CMOS devices static problems， one is surrounded around the trench gate structure。 In contrast， TFETs is dependent steep subthreshold slope transistors to reduce power consumption。

This race is far from over。 Apparently between the chip manufacturer might have reached the following consensus: the next generation of the device structure selection， including III-V family of FinFET； ring gate FinFET； quantum wells； silicon nanowires； SOIFinFET and TFET and so on。

The future is still a long way to go。 In addition， there may be another way to adopt a vertical chip architecture， such as 2。5D/3D stacked chips and chip 3DIC。

In short， Intel， TSMC and some other companies， they are considered the ring-gate technology may be slightly upper hand。 Intel´s Mayberry said Intel is also studying it， it may be acceptable to everyone can process roadmap。

Chip manufacturers may need to develop more than one type of architecture， because no single technology for future applications is an ideal choice。 Intel Corporation vice president， director of manufacturing technology and components MichaelMayberry said。 This can not be a single answer， there are many different answers to different market segments。FPC CONNECTOR "

Intel also for TFET technology expressed interest， although other people have different opinions。 The final winners and losers will depend on cost， manufacturability and functionality。 Mayberry said， for example， the most promising is the gate of the transistor is surrounded aroundTACT SWITCH the carbon nanowires， but we do not know how to achieve it。 So this may notPHONE JACK be an optimal option， it must be able to be in volume production。

Another problem is that the industry is still able to maintain the rhythm of a biennial process technology nodes。 As more and more economic factors come into play， I believe the future of the semiconductor industry moves to the next process node time will slow down， or even may not be scaled down by 70%HDMI CONNECTOR， while theUSB CONNECTOR extension of the next generation of process nodes。